Prozessor:
  1. Support for 10th Generation Intel® Core™ i9 processors/Intel® Core™ i7 processors/Intel® Core™ i5 processors/Intel® Core™ i3 processors/Intel® Pentium® processors/Intel® Celeron® processors in the LGA1200 package
  2. L3 cache varies with CPU
Chipsatz: Intel® H470 Express Chipset
Speicher:
  1. Intel® Core™ i9/i7 processors:
    Support for DDR4 2933/2666/2400/2133 MHz memory modules
  2. Intel® Core™ i5/i3/Pentium®/Celeron® processors:
    Support for DDR4 2666/2400/2133 MHz memory modules
  3. 2 x DDR4 DIMM sockets supporting up to 64 GB (32 GB single DIMM capacity) of system memory
  4. Dual channel memory architecture
  5. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
  6. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
  7. Support for Extreme Memory Profile (XMP) memory modules
Grafik: Integrated Graphics Processor-Intel® HD Graphics support:
  1. 1 x D-Sub port, supporting a maximum resolution of 1920x1200@60 Hz
  2. 1 x DVI-D port, supporting a maximum resolution of 1920x1200@60 Hz
    • The DVI-D port does not support D-Sub connection by adapter.
  3. 1 x HDMI port, supporting a maximum resolution of 4096x2160@30 Hz
    • Support for HDMI 1.4 version and HDCP 2.3.

    4. Support for up to dual-display at the same time
    Maximum shared memory of 512 MB

Steckplätze:
  1. 1 x PCI Express x16 slot, running at x16
  2. 2 x PCI Express x1 slot
    (The PCI Express slots conform to PCI Express 3.0 standard.))
Supports up to ASPM L1.2 power management protocols.
Storage:
  1. 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280 SATA and PCIe x4/x2 SSD support)
  2. 4 x SATA 6Gb/s connectors
  3. Support for RAID 0, RAID 1, RAID 5, and RAID 10
  4. Intel® Optane™ Memory Ready
M.2 connectors support up to ASPM L1.2 PCIe power management protocols.
Sound:
  1. Realtek® Audio CODEC
  2. High Definition Audio
  3. 2/4/5.1/7.1-channel
    • To configure 7.1-channel audio, you need to open the audio software and select Device advanced settings > Playback Device to change the default setting first. Please visit GIGABYTE's website for details on configuring the audio software.
LAN:
  1. Intel® GbE LAN chip (1000/100 Mbit)
USB:
  1. 4 x USB 3.2 Gen 1 ports (2 ports on the back panel, 2 ports available through the internal USB header)
  2. 6 x USB 2.0/1.1 ports (4 ports on the back panel, 2 ports available through the internal USB header)
Anschlüsse Rückseite:
  1. 1 x PS/2 keyboard port
  2. 1 x PS/2 mouse port
  3. 1 x D-Sub port
  4. 1 x DVI-D port
  5. 1 x HDMI port
  6. 2 x USB 3.2 Gen 1 ports
  7. 4 x USB 2.0/1.1 ports
  8. 1 x RJ-45 port
  9. 3 x audio jacks
Anschlüsse intern:
  1. 1 x 24-pin ATX main power connector
  2. 1 x 8-pin ATX 12V power connector
  3. 4 x SATA 6Gb/s connectors
  4. 1 x CPU fan header
  5. 1 x system fan header
  6. 1 x RGB LED strip header
  7. 1 x front panel header
  8. 1 x front panel audio header
  9. 1 x speaker header
  10. 1 x USB 3.2 Gen 1 header
  11. 1 x USB 2.0/1.1 header
  12. 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
  13. 1 x serial port header
  14. 1 x Clear CMOS jumper
Formfaktor: Micro ATX Form Factor: 22.6 cm x 18.5 cm
unterstütze Betriebssysteme: - Microsoft® Windows® 10 64-bit